HEF4094BP DATASHEET PDF

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. The latest product status. General description 2. Features 3.

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Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

The latest product status. General description 2. Features 3. Ordering information Table 1. It has a storage latch associated with each stage for strobing data from the serial input to parallel buffered 3-state outputs QP0 to QP7.

The parallel outputs may be connected directly to common bus lines. Data is shifted on positive-going clock transitions. Serial data is available at QS1 on positive-going clock edges to allow high-speed operation in cascaded systems with a fast clock rise time.

The same serial data is available at QS2 on the next negative going clock edge. This is used for cascading HEFB devices when the clock has a slow rise time. Functional diagram Fig 2. All rights reserved. Product data sheet Rev. Pinning information 5. Pin configuration 5. Fig 5. Recommended operating conditions Table 5. Recommended operating conditions 9. Table 8. Waveforms Measurement points are given in Table 9.

Fig 6. Clock to outputs propagation delays, and clock pulse width and maximum frequency Table 9. Fig 7. Fig 8. Fig 9. Fig Test circuit Table Application information Fig Plastic or metal protrusions of 0. SOT 0. Abbreviations Table Revision history Table Package SOT74 removed from Section 3.

Legal information Product [short] data sheet Production This document contains the product specification. The content is still under internal review and subject to formal approval, which may result in modifications or additions.

NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number s and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information.

For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice.

This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or Contact information malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Limiting values — Stress above one or more limiting values as defined in the Absolute Maximum Ratings System of IEC may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied.

Exposure to limiting values for extended periods may affect device reliability. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Contents 1 General description. Short-link Link Embed.

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HEF4094BP Datasheet

We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information. Serial data is available at QS1 on positive-going clock edges to allow , QS2 on the next negative going clock edge.

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